Max Planck Institute for Chemical Physics of Solids - Library Catalog

Thermal contact conductance C. V. Madhusudana

By: Material type: TextTextLanguage: English Series: Mechanical engineering seriesPublisher: Cham Heidelberg [u.a.] Springer 2014Edition: 2nd edDescription: XVIII, 260 S. Ill., graph. DarstContent type:
  • Text
Media type:
  • ohne Hilfsmittel zu benutzen
Carrier type:
  • Band
ISBN:
  • 9783319012759
Subject(s): Additional physical formats: Erscheint auch als: Thermal Contact ConductanceDDC classification:
  • 621.402/23 23
  • 621.4022
  • 621.402/2
LOC classification:
  • TJ260
Other classification:
  • UG 2600
  • 50.38
Online resources: Summary: This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the fieldSummary: 1. Introduction -- 2. Thermal construction resistance -- 3. Solid spot thermal conductance of a joint -- 4. Gap conductance at the interface -- 5. Experimental aspects -- 6. Special configuration and processes -- 7. Control of thermal contact conductance using interstitial materials and coatings -- 8. Major applications -- 9. Additional topics -- 10. Concluding remarks
Tags from this library: No tags from this library for this title. Log in to add tags.
Holdings
Item type Current library Call number Materials specified Status Date due Barcode
Buch MPI CPfS UG 2600 MADH (Browse shelf(Opens below)) Available 10007099

Literaturangaben

This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field

1. Introduction -- 2. Thermal construction resistance -- 3. Solid spot thermal conductance of a joint -- 4. Gap conductance at the interface -- 5. Experimental aspects -- 6. Special configuration and processes -- 7. Control of thermal contact conductance using interstitial materials and coatings -- 8. Major applications -- 9. Additional topics -- 10. Concluding remarks

Imprint

Data Protection Advice

© 2023 MPI CPfS / GWDG

Powered by Koha