TY  - BOOK
AU  - Madhusudana,Chakravarti V.
TI  - Thermal contact conductance
T2  - Mechanical engineering series
SN  - 9783319012759
AV  - TJ260 
U1  - 621.402/23 23
PY  - 2014///
CY  - Cham, Heidelberg [u.a.]
PB  - Springer
KW  - Heat
KW  - Conduction
KW  - Surfaces (Technology)
N1  - Literaturangaben
N2  - This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field; 1. Introduction -- 2. Thermal construction resistance -- 3. Solid spot thermal conductance of a joint -- 4. Gap conductance at the interface -- 5. Experimental aspects -- 6. Special configuration and processes -- 7. Control of thermal contact conductance using interstitial materials and coatings -- 8. Major applications -- 9. Additional topics -- 10. Concluding remarks
UR  - https://www.loc.gov/catdir/enhancements/fy1612/2013943984-b.html
UR  - https://www.loc.gov/catdir/enhancements/fy1612/2013943984-d.html
UR  - https://www.loc.gov/catdir/enhancements/fy1612/2013943984-t.html
ER  -