Chemical-mechanical planarization of semiconductor materials 
 chemical-mechanical 
M. R. Oliver (ed.) 
 - X, 425 S  ill 
 - Springer series in materials science  69 .
 - Springer series in materials science  69 .
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>3540431810   : $149,00 : CIP entry (Nov.) 
<br/><br/><label>Standard No.: </label>9783540431817 2003-59075 
<br/><br/><label>LCCN: </label>2003059075 
<br/><br/><label>Nat. Bib. Agency Control No.: </label>3540431810  UK 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductors--Materials<br/>Chemical mechanical planarization<br/>Semiconductors--Materials<br/>Grinding and polishing
<br/><br/><label>LC Class. No.: </label>TK7871.85 
<br/><br/><label>Dewey Class. No.: </label>621.38152 621.3815/2 620